PROCESS CAPABILITY
PROCESS CAPABILITY
PROCESS CAPABILITY
PROCESS CAPABILITY
| Process | Process | Control Items | Capability Range | Remarks |
| Material Cutting | Material Cutting | Maximum Cutting Size | 360mm×nfinite Length | |
| Minimum Cutting Size | 250×1mm | |||
| Conventional Material Width | 250mm | |||
| Cutting Size Tolerance | ±0.2mm | |||
| Laser Drilling | Laser Drilling Specifications Range | Maximum Single Drilling Size | 630×530mm | |
| Maximum Multiple Drilling Size | 500×Infinite Length | Requires multiple segmented laser steps | ||
| Minimum Drilling Diameter | ≧25um | |||
| CPK | ≧1.33 | |||
| Positional Accuracy | ±15um | |||
| Aspect Ratio (Hole Diameter vs. Depth) | ≧90% | |||
| Circularity | ≧98% | For holes above 75um | ||
| Drilling | Laser Drilling Specifications Range | Maximum single drilling size | 600×500mm | Insulation board requires special specifications |
| Maximum multiple drilling size | 500×Infinite Length | Need for secondary positioning | ||
| Maximum hole diameter | 6.4mm | |||
| Minimum hole diameter | 0.1mm | |||
| Minimum slot width | 0.6mm | |||
| Minimum hole edge to hole edge spacing | 0.15mm | |||
| Hole center to hole center distance tolerance | 0.05mm | |||
| Hole diameter tolerance | 0.025mm | |||
| Copper Deposition & Plating | Copper Plating Thickness | Plated Through Hole (PTH) Copper Thickness for Double-Sided Boards | ≥12um | Customer special requirements apply |
| TP Value (Tent & Peel) | 150-200% | |||
| Dry Film Lamination | Dry Film Lamination Specifications | Maximum Lamination Size | 500×Infinite Length | Dry film requires 500mm width specification |
| Conventional Dry Film Width | 250mm | |||
| Dry Film Thickness | 20-50um | |||
| Lamination Tolerance | ±1mm | |||
| Circuit Formation | Exposure Specifications | Alignment Accuracy | ±0.008mm | |
| Layer-to-Layer Misregistration | ±35um | |||
| Film Design / Etching Tolerance | Minimum Line Width/Spacing for 1 oz Copper | 0.08mm/0.07mm±0.04mm | Single-sided board, after film compensation | |
| 0.1mm/0.075mm±0.04mm | Single-sided board, after film compensation | |||
| Minimum Line Width/Spacing for 1/2 oz Copper | 0.05mm/0.05mm±0.02mm | Single-sided board, after film compensation | ||
| 0.75mm/0.75mm±0.02mm | Single-sided board, after film compensation | |||
| Minimum Line Width/Spacing for 1/3 oz Copper | 0.05mm/0.05mm±0.015mm | For surface copper ≤20um, spacing ≥50um achievable; for surface copper >20um, spacing ≥60um achievable | ||
| Minimum Distance from NPTH Hole to Line | ≥0.2mm | |||
| Bonding / Lamination | Coverlay Processing | Minimum Opening Diameter for Coverlay | 0.06mm | |
| Minimum Square/Rectangular Opening | 0.6×0.6mm | |||
| Minimum Spacing Between Openings | 0.2mm | |||
| Minimum Clearance from Opening to Pad or Trace | 0.1mm | |||
| Lamination Accuracy | Alignment Accuracy for Protective Film | ≦75um | Ignores coverlay expansion/shrinkage, assumes automatic alignment | |
| EMI, Stiffener, Adhesive | ≦75um | Ignores coverlay expansion/shrinkage, assumes automatic alignment | ||
| Press Lamination Size | Single Press Lamination Size | 2200×300mm | High-temperature film requires special order | |
| Multiple Press Lamination Size | 250×Infinite Length | |||
| Surface Treatment | Plating / ENIG (Electroless Nickel Immersion Gold) | Electroplated / Electroless Nickel-Gold Thickness | Ni:2-8um,Au:0.03-0.09um | |
| OSP | OSP (Organic Solderability Preservative) Thickness | 0.2-0.75um | ||
| Silkscreen Printing | Solder Mask (Photoimageable) | Minimum Solder Mask Opening Diameter | 0.15mm | |
| Minimum Solder Mask Bridge | 0.075mm | |||
| Solder Mask Thickness | 15-25um | |||
| Screen Printing Alignment Accuracy | ±0.10mm | |||
| Silkscreen | Minimum Character Height | 0.7mm | ||
| Minimum Stroke Width | 0.12mm | |||
| Screen Printing Alignment Accuracy | ±0.1mm | |||
| Black Ink (Legend) | Screen Printing Alignment Accuracy | ±0.1mm | ||
| Ink Thickness | 8-20um | |||
| Dimensional Specifications | Conventional Squeegee Length | 30cm | ||
| Maximum Single Print Size | 35×50cm | Squeegee requires special fabrication | ||
| Maximum Multiple Print Size | 250×Infinite Length | |||
| Electrical Testing | Dimensional Specifications | Maximum Test Points | 5000 | |
| Maximum Product Size for Testing | 2200*300 | |||
| Minimum Probe Size | 0.12mm | |||
| Minimum Probe Pitch (Center-to-Center) | 0.25mm | |||
| Mechanical Drilling | Dimensional Specifications | Conventional Hole Diameter | 2mm | |
| Punching Accuracy | ≤0.025mm | |||
| Forming / Molding | Punching/Blanking Tolerance | Wooden Die | ±0.3mm | |
| Etched Steel Rule Die | ±0.15mm | |||
| Standard Steel Hard Die | ±0.1mm | |||
| Precision Steel Hard Die | ±0.5mm | |||
| rregular-Shaped Punching | ±0.05mm | |||
| Thickness Tolerance | Standard Single/Double-Sided Boards | ±0.03mm | ||
| ±0.05mm | ||||
| Coding | Black Font | Minimum Character Height | 0.8mm | |
| White Font | Minimum Character Height | 1.5mm |
Total Pitch
Total Pitch
| Total Pitch | 2024 | |
| 公差 | CPK | |
| 0＜pitch≤40 | ±0.03mm | ≥1.67 |
| 40＜pitch≤70 | ±0.04mm | ≥1.67 |
| 70＜pitch≤100 | ±0.05mm | ≥1.67 |
| 100＜pitch≤150 | ±0.07mm | ≥1.67 |
| 150＜pitch≤200 | ±0.09mm | ≥1.67 |
| 200＜pitch≤250 | ±0.12mm | ≥1.67 |
ZIF Finger
ZIF Finger
| Dimension Type | Tolerance | Cpk Ability |
| Outline to Outline | ±0.05 | ≥1.67 |
| ±0.07 | ≥1.67 | |
| Outline to Finger Center | ±0.05 | ≥1.67 |
| ±0.07 | ≥1.67 | |
| ±0.1 | ≥1.67 |
SMT capability
SMT capability
| 项目 | 规格 | |
| 零件大小 | L、C、R | Min 008004 |
| IC | Max 38*38mm | |
| 最大FPC尺寸 | 400*1200mm | |
| Min Pitch | 连接器 | 0.35mm |
| BGA封装 | 0.35mm | |
| QFN封装 | 0.35mm | |
| 贴装精度 | LED灯角度 | ±1° |
| 阻容件间距离 | ≥0.25mm | |
| 阻容器件距IC距离 | ≥0.25mm | |
| 贴片机精度 | ±0.05mm |
Copyright © Xiamen Long-Shine Flex Co., Ltd. All rights reserved. | 
Scan the QR Code to Learn More | Postal Code:361000 Address: No. 1 Xianghong Road, Torch Industrial Zone (Xiang’an), Xiamen, China Tel: +86 592 7395168 / 7395167 / 7395166 Email: yq@chinafpc.cn
|
0592-7395168